7.0" FHD+ AMOLED Display with 144Hz & On-Cell Touch

1080×1920 | 315 PPI | 60/90/120/144 Hz | On‑Cell Touch (FT3519) | Driver ICNA3512 | MIPI DSI 4‑Lane | HBM 1000 nits

Contrast≥ 100,000:1

Response≤ 2 ms

Brightness800 typ / 1000 HBM cd/m²

Viewing80° (U/D/L/R)

1) General Specifications

Screen Size	7.0 inch (portrait)
Technology	AMOLED (LTPS)
Resolution	1080 (W) × 1920 (H)
Active Area	87.1344 (H) × 154.9056 (V) mm
Pixel Density	315 PPI
Pixel Layout	V‑style4
Touch	On‑Cell, FT3519

Display IC	ICNA3512
Frame Rate	60 / 90 / 120 / 144 Hz (configurable)
Module Outline	89.1344 × 160.9056 × 1.028 mm
Interface	MIPI DSI 4‑Lane + TE
Compliance	RoHS 2.0

Note: This article consolidates the PDF “7.0INCH AMOLED Module (Vertical type).pdf” Rev.V1.

2) IO Terminals & Pin Assignment

2.1 Main FPC — OK‑F302‑39115

#	Signal	I/O	Description
1–3,9,12,15,18,21,24,27,32	GND	P	Ground
4–8	VBAT	P	EL PMIC power (4.0–4.8 V, typ 4.2 V)
10,11,39	NC	/	No connect
13,14	D3P/D3N	I	MIPI Data Lane 3
16,17	D0P/D0N	I/O	MIPI Data Lane 0
19,20	CLKP/CLKN	I	MIPI Clock
22,23	D1P/D1N	I	MIPI Data Lane 1
25,26	D2P/D2N	I	MIPI Data Lane 2
28	RST	I/O	Display reset
29	VDDI	P	Logic power (1.65–1.95 V, typ 1.8 V)
30	VCI	P	Analog power (2.65–3.60 V, typ 3.0 V)
31	TE	O	Tearing effect sync
33	TP_AVDD	P	Touch analog power (2.7–3.6 V)
34	TP_DVDD	P	Touch digital power (1.7–3.6 V)
35,36	TP_SDA/TP_SCL	I/O,I	Touch I²C
37	TP_RESET	I	Touch reset
38	TP_INT	I	Touch interrupt

Legend: I=Input, O=Output, P=Power, I/O=Bidirectional.

2.2 System Interface Topology

VBAT → EL PMIC         VDDI (1.8 V) → DDIC logic     VCI (3.0 V) → DDIC analog
MIPI DSI 4-Lane → ICNA3512           TE → Host sync
Touch: FT3519 via I²C (SCL/SDA) + INT + RESET

3) Absolute Maximum Ratings

Item	Symbol	Min	Max	Unit	Note
Logic Supply	VCI	–	3.6	V	Do not exceed
Analog Supply	VDDIO	–	3.6	V	Per doc naming
PMIC Supply	VBAT	–	7.0	V	Absolute max

Operating near/over absolute maxima can cause permanent damage and reduce reliability.

4) Electrical Characteristics (Ta=25 °C)

Item	Symbol	Min	Typ	Max	Unit
Logic Supply	VDDI	1.65	1.80	1.95	V
Analog Supply	VCI	2.65	3.00	3.60	V
Default VBAT	VBAT	4.0	4.2	4.8	V
Input VIH	VIH	0.70×VDDI	–	VDDI	V
Input VIL	VIL	0	–	0.30×VDDI	V
Output VOH	VOH	0.80×VDDI	–	VDDI	V
Output VOL	VOL	0	–	0.20×VDDI	V

Current/power measured at white pattern, 25 °C.

5) AC Characteristics

5.1 MIPI DSI

Supports 4‑lane HS burst. Follow ICNA3512 D‑PHY timing for LP↔HS transitions, setup/hold, eye margins, and skew.

5.2 RESET Timing

At VDDI=1.65–1.95 V, VCI=2.65–3.6 V, −40~85 °C: hold RST=Low ≥10 ms, then High ≥20 ms before DSI init.

6) Recommended Power On/Off Sequence

6.1 Power‑On

Enable VDDI → VCI → VBAT with 2–5 ms inter‑rail delays.
RST=Low (≥10 ms) → High (≥20 ms).
Configure MIPI, send init table, set gamma/brightness/frame rate.

6.2 Power‑Off

Display OFF, wait frame end.
Disable VBAT → VCI → VDDI.
Ensure DSI back to LP before rails drop.

// Pseudo code
enable(VDDI); delay_ms(2);
enable(VCI);  delay_ms(2);
rst_low();     delay_ms(10);
rst_high();    delay_ms(20);
mipi_init(4_lanes, clk_hz);
dsi_write_seq(init_table);
set_gamma(2.2);
set_brightness(nits_to_code(300));
set_fps(120);
dsi_cmd(DISPLAY_ON);

7) Touch Design (FT3519, On‑Cell)

7.1 Matrix & Pattern

Structure: On‑Cell, diamond pattern, 2T1R
Channels: Tx=20 / Rx=36
Pitch: Tx 4.359 mm / Rx 4.3042 mm

7.2 Power

TSP_AVDD: 2.8 / 3.0 / 3.3 V (2.7–3.6 V)
TSP_VDDIO: 1.8 V default (1.7–3.6 V or same as AVDD)

7.3 Touch FPC (10‑pin)

#	Signal	Description
1	GND	Ground
2	TSP_AVDD	Touch analog power
3	TSP_VDDIO	Touch digital power
4	TSP_INT	Touch interrupt
5	TSP_SDA	I²C data
6	TSP_SCL	I²C clock
7	TSP_RESET	Touch reset
8	TSP_VSYNC	Display VSYNC (sync)
9	NC	No connect
10	GND	Ground

Use 4.7 kΩ pull‑ups on SDA/SCL (tune for bus capacitance). Place ESD TVS near connector. Keep I²C away from MIPI/PMIC traces.

Reference BOM (excerpt)

C1~C4: 1 µF / 6.3 V / 0402; C5: 1 µF / 16 V / 0402; C6: 1 µF / 10 V / 0402
D1: TVS 5 V / 0402; D2: TVS 3.3 V / 0402
U1: FT3519

8) Optical Characteristics

Item	Condition	Min	Typ	Max	Unit	Note
Viewing Angle (U/D/L/R)	CR≥20000	80	–	–	deg	Symmetric
Contrast Ratio	θ=0°	100,000	–	–	–	CS2000A
White CIE (x,y)	Center	0.290/0.296	0.310/0.316	0.330/0.336	–	CIE1931
Red (x,y)	Center	0.652/0.285	0.682/0.315	0.712/0.345	–	–
Green (x,y)	Center	0.200/0.676	0.240/0.716	0.280/0.756	–	–
Blue (x,y)	Center	0.108/0.016	0.138/0.046	0.168/0.076	–	–
Luminance Uniformity	9‑point	75	–	–	%	Lmin/Lmax
NTSC Coverage	–	100	–	–	%	Nominal
Luminance (Normal)	White	720	800	880	cd/m²	CS2000A
Luminance (HBM)	White	900	1000	1100	cd/m²	CS2000A
Flicker	G127 / 60 Hz / 800 nits	–	−30	–	dB	CA410 JEITA
Crosstalk	–	–	2	–	%	–
Response Time	25 °C	–	–	2	ms	TON/TOFF
Gamma	Gray16–240	2.0	2.2	2.4	–	–

Dark room center measurement at 25 °C. Equipment: CS2000A / CA410.

9) Environmental / Reliability

#	Test	Condition	Standard
1	High‑Temp Operation	+70 °C, 120 h	IEC 62341‑5:2009
2	Low‑Temp Operation	−20 °C, 120 h	IEC 62341‑5:2009
3	High‑Temp Storage	+80 °C, 120 h	IEC 62341‑5:2009
4	Low‑Temp Storage	−40 °C, 120 h	IEC 62341‑5:2009
5	Thermal Shock	−40↔+80 °C, 30 min dwell, 30 cycles	IEC 62341‑5:2009
6	HTHH Operation	60 °C, 90%RH, 120 h	IEC 62341‑5:2009

10) Appearance & Quality Levels

10.1 Defect Classes

CR (Critical): Safety or complete functional loss.
MA (Major): Function degraded/partial loss; or ≥3 Minor combined.
MI (Minor): Cosmetic, no functional impact.

10.2 Sampling & AQL

Sampling: GB/T 2828.1‑2012 (normal inspection)
AQL: CR=0; MA=0.65; MI=1.0

10.3 Inspection Conditions

Unlit 1000±200 lux; lit ≤200 lux; black background.
Distance 30±5 cm; Angle ±45° (up to 75° for special issues).
Time: unlit 10–12 s; lit 1–3 s per pattern; 15–35 °C, 20–75%RH.

10.4 Typical Cosmetic Criteria (excerpt)

Bright dots/lines: Not allowed.
Dark dot: D≤0.15 mm ignore (mottling excluded); D>0.15 mm NG.
Foreign dots: D≤0.15 mm & DS≥30 mm ignore; 0.15<D≤0.20 with N≤2 & DS>50 mm OK; D>0.20 mm NG.
Line scratch: W≤0.03 & L≤5 & DS≥10 ignore; 0.03<W≤0.05 & L≤2 ignore; 2<L≤5 N≤4; L>5 or W>0.5 NG.
POL overflow: W≤0.2 mm ignore; W>0.2 mm NG.
Glass chipping: zone‑based PAD/Bonding/OA limits per drawing.

11) Mechanical & Packaging

11.1 Key Mechanical Notes

Module thickness 1.028 mm (incl. POL & foam). Local stack‑ups (FPC/steel/IC) must meet drawing Hmax.
Connectors: Main FPC OK‑F302‑39115; Touch FPC OK‑F501‑10325.
Tear tabs/double‑sided tapes/foams per drawing; must not intrude AA.

11.2 Packing

Tray surface resistivity 10⁴–10⁹ Ω; 4 pcs/tray.
Carton: 24 trays (22 full + 2 empty PET trays) → 88 pcs/carton.

12) Precautions for Use

Glass module: avoid drop/impact; do not press screen/edges.
POL surface is soft; blow then dry‑wipe; if solvent needed use ethyl alcohol only.
No water/ketone/aromatic solvents. Do not disassemble.
Do not feed signals when logic power is off. Ensure ESD control; avoid overly dry environments.
Peel protective film slowly with ESD grounding.
Storage: 0–40 °C, ≤80%RH, no acid/alkali/harmful gas, avoid light. Transport: prevent drop/pressure/wet/sun.

13) Application Scenarios & Design Recommendations

13.1 Consumer & Premium Handhelds

Android handheld consoles: portrait 7” ideal for indie/retro; 120/144 Hz reduces blur; OLED blacks boost contrast.
High‑end e‑book/note devices: 315 PPI crisp text; HBM 1000 nits; TE helps judder‑free page turns.
Smart home panels: premium contrast; flicker control (≤ −30 dB, JEITA) supports eye comfort.

13.2 Industrial HMI / Rugged Terminals

Factory/UAV ground stations: −20~+70 °C operation; thermal shock resilience aids outdoor deployments.
Medical/Diagnostic carts: 80° viewing all sides, good for collaborative review.
Retail POS/Kiosks: HBM 1000 nits for glare; 100% NTSC for brand‑true colors.

13.3 Automotive / Mobility

Rear‑seat systems: deep blacks and 120 Hz; crosstalk ≤2% keeps UI crisp.
Cluster‑adjacent widgets: On‑Cell touch reduces stack height; diamond matrix improves corner linearity.
Fleet tablets: low‑temp start; ESD trays protect in logistics.

13.4 Public Information / Hospitality

Room signage: high contrast and uniformity ≥75% for premium look.
Museum labels: OLED blacks suit dim rooms; gamma control avoids banding.
Airports/Stations: 1000 nits HBM for bright halls; high fps improves tickers.

13.5 Pro AV / Photography

Field monitor: near‑infinite contrast helps focus peaking; stable white CIE for quick checks.
Wireless mixer UI: TE & high refresh mitigate filming artifacts.

13.6 Education / Remote Work

Podium secondary screen: portrait notes/timers; low Mura for clean gradients.
Portable conference terminals: wide view & low flicker for long sessions.

13.7 Integration Tips

EMI/ESD: short, length‑matched MIPI pairs; TVS near FPC; dense ground stitching.
Thermal: couple PMIC to chassis; avoid AA‑edge hot spots; validate at 70 °C.
Power: enforce sequencing; budget for HBM/high‑fps current peaks; verify droop under flash scenes.
Touch: respect FT3519 reset/INT timing; keep I²C isolated from noisy regions.
Quality: use vendor patterns; AQL MA 0.65 / MI 1.0; inspect under specified lighting to catch subtle defects.

14) FAQ — Frequently Asked Questions

1) What is the correct power‑on order for this AMOLED module?

Follow: VDDI → VCI → VBAT → RESET High → DSI init → Display ON.

Hold RST=Low ≥10 ms after rails are stable, then High ≥20 ms.
Configure MIPI, push init table before enabling display output.
Power‑off: Display OFF → VBAT → VCI → VDDI.

// Quick sketch
enable(VDDI); delay_ms(2);
enable(VCI);  delay_ms(2);
rst_low();     delay_ms(10);
rst_high();    delay_ms(20);
mipi_init(4_lanes, clk);
dsi_write_seq(init_table);
dsi_cmd(DISPLAY_ON);

2) How many MIPI lanes are supported? What about TE?

Up to 4‑Lane MIPI DSI in HS burst.
TE available for frame sync, tearing mitigation.

3) What are the power rails and typical voltages?

Rail	Nominal	Range	Purpose
VDDI	1.8 V	1.65–1.95 V	DDIC logic
VCI	3.0 V	2.65–3.60 V	DDIC analog
VBAT	4.2 V	4.0–4.8 V (max abs 7 V)	EL PMIC / emission
TSP_AVDD	2.8/3.0/3.3 V	2.7–3.6 V	Touch analog
TSP_VDDIO	1.8 V	1.7–3.6 V	Touch logic

4) What brightness and flicker can I expect?

800 cd/m² typical, 1000 cd/m² HBM (900–1100 range).
Uniformity ≥75% (9‑point).
Flicker ≤ −30 dB @ Green127, 60 Hz, 800 nits (JEITA).

5) What is the supported temperature range?

Operation: −20 °C to +70 °C
Storage: −40 °C to +80 °C
Thermal shock tested per IEC 62341‑5.

6) Does it support high refresh like 120/144 Hz?

Yes. Ensure MIPI bandwidth, proper init scripts, synced TE/Vsync, and sufficient power budget at high fps.

7) How to wire/protect the touch (FT3519)?

I²C with 4.7 kΩ pull‑ups (tune by bus cap).
TVS at connector; keep I²C away from MIPI/PMIC areas.
Respect reset/INT timings.

8) Any mechanical/packing cautions?

H_max limits in drawing must be respected at FPC/steel/IC areas.
Tray ESD 10⁴–10⁹ Ω; 4 pcs/tray; 88 pcs/carton.

9) How to perform cosmetic inspection?

Unlit 1000±200 lux; lit ≤200 lux; distance 30±5 cm; ±45° viewing.
Bright dots/lines NG; dark dot D≤0.15 mm OK; >0.15 mm NG.
Use ND 6% for Mura; gauges for coverage; microscope 20–50×.
AQL: CR=0; MA=0.65; MI=1.0.

10) Suitable application scenarios?

Handheld consoles, premium e‑readers, smart home panels.
Industrial HMI, medical carts, POS/kiosks.
Rear‑seat entertainment, dash‑adjacent widgets.
Public info/hospitality signage; Pro AV field monitors.

11) Any ESD/EMI and power tips?

Short, matched MIPI lanes, correct impedance; TVS near FPC.
Strict power sequencing; budget for HBM/fps peaks.
Thermally couple PMIC; avoid AA‑edge hot spots.

12) Which solvents are safe?

Only ethyl alcohol for POL surface. Water, ketones, aromatics are prohibited.

13) Protective film handling?

Peel slowly with ESD grounding; peeling can generate static hazardous to OLED/IC.

14) How to measure optics correctly?

Dark room, center, 25 °C; CS2000A for luminance/CR/CIE; CA410 for flicker/gamma.
Uniformity on 3×3 grid; report Lmin/Lmax and center separately.

15) High‑humidity operation supported?

Qualified at 60 °C, 90%RH, 120 h (IEC 62341‑5). Still design for moisture barriers and avoid condensation.

7.0" FHD+ AMOLED Display with 144Hz & On-Cell Touch

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